
Designed for precision electronics manufacturing with a focus on high efficiency, intelligence, and stability
I. Core Technical Highlights
- Intelligent Light Control System
Equipped with stepless dimming technology, it dynamically adjusts UV intensity based on process requirements, ensuring optimal curing for applications ranging from fine circuit patterns to high-density components. - Precision Optical Design
Features an imported composite optical system (reflectors + optical filters) that ensures uniform light spot distribution and precise wavelength control, eliminating edge effects and guaranteeing consistency in curing solder resist inks and photosensitive materials. - Full Automation
Integrated with Mitsubishi PLC and an industrial-grade touchscreen interface, it enables preset process parameters, production data tracking, and real-time alarms, achieving intelligent coordination across the entire workflow (sensing → conveying → curing → exhaust).
II. Scenario-Specific Advantages
- Precision Electronics Manufacturing
Utilizes a Teflon roller conveying system for non-damaging transport of ultra-thin substrates (e.g., <25mm thickness), ideal for PCBs and flexible circuits. - Eco-Friendly Production
A modular exhaust system with adjustable airflow minimizes VOC emissions, while energy-saving modes reduce standby power consumption, complying with environmental regulations and cleanroom standards. - High Reliability
Modular sheet metal structure design allows rapid maintenance and replacement of core components (e.g., UV lamp arrays, control systems), ensuring 24/7 continuous operation with minimal downtime.
III. Key Applications
- Electronic Packaging: Curing solder resist inks, UV adhesives for chip packaging.
- Optical Components: Polarizer film curing for displays, coating treatment for optical lenses.
- Precision Processing: Microelectronics assembly bonding, post-curing for 3D-printed parts.
By merging process adaptability with production controllability, this system stands as a critical solution for enhancing yield rates and manufacturing efficiency in advanced electronics.
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